Position Summary
The Director of Engineering will lead SwiftLink Technologies’ engineering organization and oversee the end-to-end development, delivery, and commercialization of advanced RFIC/SoC, millimeter-wave, wireless communication, and satellite communication products.
SwiftLink Technologies is developing advanced EMB chip technologies and next-generation RFIC/SoC solutions for 5G/6G wireless communication, NTN, LEO satellite communication, phased-array systems, broadband connectivity, and high-capacity communication networks. This role requires a senior engineering leader with strong technical depth, full-lifecycle semiconductor product development experience, and the ability to manage complex engineering programs from initial concept and project initiation through architecture, design, verification, tapeout, packaging, testing, validation, customer sampling, and production readiness.
The ideal candidate will have direct experience in semiconductor, RFIC, SoC, wireless communication, satellite communication, telecom infrastructure, or related advanced technology industries. This person must be able to supervise every critical stage of the product development process, identify and mitigate technical and execution risks, improve internal engineering discipline, coordinate internal and external technical resources, and help the company bring products to market faster and more reliably.
At SwiftLink Technologies Inc., the Director of Engineering will play a key role in managing EMB chip development, millimeter-wave RFIC/SoC programs, ASIC/RFIC tapeout execution, post-silicon validation, RF and system testing, customer technical support, and coordination among R&D, PMO, manufacturing partners, foundries, packaging/testing vendors, strategic partners, and customers.
Key Responsibilities
1. Engineering Leadership
- Lead and manage multidisciplinary engineering teams, including RFIC, SoC, mixed-signal IC, system architecture, hardware, software/firmware, antenna, phased-array, packaging, test, validation, and application engineering groups.
- Develop engineering strategies aligned with SwiftLink’s product roadmap, EMB chip development plan, customer requirements, commercialization timeline, and long-term 5G/6G and satellite communication strategy.
- Establish engineering processes, technical standards, design review mechanisms, documentation requirements, development flows, and project governance systems suitable for advanced semiconductor and wireless communication products.
- Build a high-performance engineering culture focused on technical excellence, execution discipline, speed, accountability, innovation, and cross-functional collaboration.
- Serve as a key technical and execution bridge between the CEO/CTO, R&D teams, PMO, operations, manufacturing partners, business development, customers, and strategic partners.
2. Full-Lifecycle Product Development
- Oversee the complete product development lifecycle from project definition, technical feasibility assessment, architecture planning, specification development, IC/RF design, verification, tapeout, packaging, testing, validation, qualification, and customer sampling through to market delivery.
- Lead early-stage product planning for RFIC/SoC and wireless communication products, including technical feasibility, resource estimation, development schedule, cost structure, risk assessment, and commercialization path.
- Ensure engineering programs meet technical specifications, performance targets, schedule milestones, budget requirements, quality standards, and customer application needs.
- Coordinate and lead key technical reviews, including product requirement reviews, system architecture reviews, RFIC/SoC design reviews, tapeout readiness reviews, verification reviews, test plan reviews, post-silicon validation reviews, and production readiness reviews.
- Drive continuous improvement in product performance, bandwidth, integration level, power efficiency, RF performance, reliability, manufacturability, testability, and cost efficiency.
- Ensure a smooth transition from R&D prototype to engineering sample, customer sample, pilot production, and commercial deployment.
3. EMB Chip, RFIC/SoC, and Millimeter-Wave Program Management
- Oversee SwiftLink’s EMB chip development and future-generation RFIC/SoC programs for millimeter-wave, 5G/6G, NTN, LEO satellite communication, broadband wireless access, and phased-array applications.
- Manage RFIC, SoC, mixed-signal IC, and system-level semiconductor development programs, including specification definition, architecture planning, circuit design, system integration, verification, layout, tapeout, post-silicon bring-up, characterization, and production testing.
- Supervise ASIC/RFIC tapeout programs and ensure design teams follow proper design flow, review gates, verification methodology, foundry requirements, and tapeout quality standards.
- Coordinate with foundries, OSAT vendors, packaging houses, test houses, EDA vendors, antenna/module partners, component suppliers, and manufacturing partners.
- Guide post-silicon validation, RF performance characterization, debugging, calibration, test automation, yield analysis, reliability validation, and production test development.
- Work with engineering teams to identify performance gaps, design risks, integration risks, supply chain constraints, testing bottlenecks, and manufacturability issues early in the development cycle.
- Support the development of scalable engineering platforms and reusable development processes for future RFIC/SoC product generations.
4. Satellite Communication, 5G/6G, and System-Level Technical Oversight
- Provide technical oversight for products and technologies targeting 5G/6G networks, NTN systems, LEO satellite communication, phased-array communication systems, broadband wireless access, and high-capacity data transmission applications.
- Review system architectures, link budget assumptions, RF front-end requirements, frequency planning, beamforming architecture, antenna/RF integration, system specifications, and customer application requirements.
- Ensure product designs are aligned with real-world deployment needs, including ground terminals, satellite communication systems, cellular infrastructure, IoT/IoE connectivity, and other advanced communication scenarios.
- Support technology roadmap planning for current EMB products and next-generation RFIC/SoC platforms.
- Help translate market demand and customer requirements into executable engineering specifications, product development plans, and technical milestones.
5. Team Management and Talent Development
- Recruit, mentor, and develop high-performing engineering talent across RFIC, SoC, system, antenna, software/firmware, test, validation, packaging, and application engineering disciplines.
- Define team structure, role responsibilities, reporting lines, resource allocation, and engineering ownership based on project priorities.
- Conduct performance reviews, establish development plans, and support career growth for engineering staff.
- Improve collaboration and communication across R&D, PMO, product, manufacturing, customer support, and executive teams.
- Ensure engineering resources are effectively allocated across current EMB chip development, next-generation product development, customer support, testing/validation, and strategic technology projects.
6. Project Execution and Risk Management
- Define and manage project schedules, budgets, engineering resource plans, milestones, deliverables, and development priorities.
- Monitor engineering progress and proactively identify risks related to IC design, RF performance, system integration, tapeout schedule, packaging, testing, validation, supply chain, cost, customer delivery, and production readiness.
- Establish clear project gates and decision points from project initiation to specification freeze, design freeze, tapeout, post-silicon validation, customer sampling, and commercial readiness.
- Report project status, technical risks, mitigation plans, resource gaps, and key decisions to the CEO, CTO, executive team, board, and other stakeholders when required.
- Improve execution efficiency by strengthening engineering documentation, design review discipline, project tracking, cross-functional coordination, and accountability mechanisms.
7. Customer, Partner, and Commercialization Support
- Support customer engagements, technical presentations, product demonstrations, design-in activities, technical troubleshooting, and product qualification.
- Work with business development, sales, product management, and executive leadership to support strategic partnerships in wireless communication, satellite communication, telecom infrastructure, semiconductor, and system integration markets.
- Coordinate technical activities with external partners, including foundries, OSAT vendors, antenna/module partners, test labs, universities, research institutions, government programs, customers, contractors, and strategic industry partners.
- Participate in investor discussions, board presentations, government funding applications, and strategic partnership meetings when technical input is required.
- Help accelerate the company’s path from R&D and prototype development to customer validation, design-in, pilot production, and commercial deployment.
Qualifications
Education
- Master's degree or higher in Electrical Engineering, RF/Microwave Engineering, Semiconductor Engineering, Microelectronics, Communications Engineering, or a related field is required; a PhD is preferred. Equivalent industry experience and a demonstrated track record will be weighed equally.
- Advanced academic or research background in RFIC, mmWave circuits, SoC, mixed-signal IC, phased-array systems, wireless communications, satellite communications, 5G/6G, or related technologies is highly desirable.
Experience
- 10+ years of engineering experience in semiconductor, RFIC, SoC, wireless communications, satellite communications, telecom infrastructure, or related advanced technology industries.
- 5+ years of engineering management or technical leadership experience.
- Proven experience leading multidisciplinary engineering teams across IC design, RF/microwave engineering, system engineering, hardware, software/firmware, antenna, packaging, test, validation, and manufacturing interfaces.
- Demonstrated experience delivering complex semiconductor, RF, wireless communication, or satellite communication products from concept to production and commercialization.
- Strong experience overseeing full product development cycles, including project initiation, architecture planning, specification definition, design execution, verification, tapeout, post-silicon validation, customer sampling, production testing, and market delivery.
Technical Skills
- Strong understanding of semiconductor and wireless communication product development processes.
- Experience with RFIC, SoC, mixed-signal IC, millimeter-wave systems, phased-array systems, beamforming, RF front-end design, satellite communication, NTN, LEO satellite systems, 5G/6G, or advanced wireless system development.
- Familiarity with ASIC/RFIC design flows, EDA tools, foundry processes, tapeout requirements, packaging technologies, post-silicon validation, RF testing, production testing, and reliability validation.
- Strong knowledge of system architecture, product specification development, design review processes, verification methodology, test planning, engineering documentation, and technical risk management.
- Experience with quality assurance, manufacturing transfer, production readiness, yield improvement, supplier coordination, and customer qualification.
- Solid project management capability, including schedule control, budget management, resource planning, milestone tracking, risk mitigation, and cross-functional execution.
Preferred Qualifications
- Direct experience managing RFIC, ASIC, SoC, or mixed-signal IC tapeout programs.
- Experience with millimeter-wave RFIC, phased-array systems, beamforming ICs, satellite communication terminals, LEO/NTN communication systems, 5G/6G infrastructure, broadband wireless access, or high-frequency communication systems.
- Familiarity with foundry, OSAT, packaging, testing, characterization, qualification, and production ramp-up processes.
- Experience supporting customer design-in, technical troubleshooting, field issue resolution, product qualification, and commercialization.
- Experience working in a startup or growth-stage technology company where hands-on execution, cross-functional coordination, resource prioritization, and speed to market are critical.
- Experience participating in technical due diligence, investor presentations, board reporting, government funding applications, or strategic partnership discussions is an asset.
Key Competencies
- End-to-end semiconductor product execution capability.
- Millimeter-wave, RFIC/SoC, wireless, or satellite communication technical depth.
- Strong technical judgment and engineering problem-solving ability.
- Leadership and team-building.
- Project planning and milestone management.
- Cross-functional coordination.
- Risk identification and mitigation.
- Communication and technical presentation skills.
- Budget, resource, supplier, and vendor management.
- Customer-oriented product delivery mindset.
- Ability to accelerate product commercialization.
Success Metrics
- Successful completion of design, verification, tapeout, packaging, post-silicon validation, RF characterization, production testing, and customer sampling milestones.
- Improved engineering execution efficiency and reduced product development cycle time.
- Product performance, bandwidth, RF characteristics, reliability, manufacturability, and quality targets met.
- Successful delivery of engineering samples, customer samples, pilot production units, and commercial-ready products.
- Effective coordination among R&D, PMO, foundries, OSAT vendors, test partners, suppliers, customers, and strategic partners.
- Strong engineering team performance, retention, accountability, and execution discipline.
- Successful commercialization of new technologies and products in wireless communication, satellite communication, and 5G/6G-related markets.
- High customer, partner, executive, and stakeholder satisfaction.
Role-Specific Focus for SwiftLink Technologies Inc.
At SwiftLink Technologies, the Director of Engineering will provide hands-on leadership across EMB chip development and future RFIC/SoC product programs. The role requires direct oversight of product definition, architecture planning, millimeter-wave RFIC/SoC design execution, tapeout preparation, post-silicon validation, packaging/testing coordination, RF performance characterization, production readiness, customer technical support, and commercialization.
This position is critical to helping SwiftLink strengthen its engineering execution system, reduce development risk, improve delivery speed, and accelerate the company’s transition from advanced technology development to market-ready products for 5G/6G wireless communication, NTN, LEO satellite communication, phased-array systems, and next-generation broadband connectivity applications.
As part of building out the engineering organization, the Director of Engineering will also participate in the concurrent search for a Testing & Applications Manager, ensuring the successful candidate can select and build a leadership team they can work with effectively.
Pay: $130,000.00-$150,000.00 per year
Benefits:
- Dental care
- Employee stock purchase plan
- Extended health care
- On-site parking
- Vision care
Work Location: In person
